3D TSV Packages Market
3D TSV Packages Market - Global Industry Assessment & Forecast
#
Pages:
142
2022
Feb - 2023
VMR-2004
Segments Covered
By
Process Realization via First Segment, via Middle Segment, via Last Segment
-
By
Applications Logic & Memory Devices, MEMS & Sensors, Power & Analog Components
-
By
End Users Consumer Electronics, Information & Communication Technologies, Automotive, Military & Defense, Aerospace, Medical
-
By
Region North America, Europe, Asia Pacific, Latin America, Middle East & Africa
Snapshot
 Base Year:
|
2022 |
| Forecast
Years:
|
2023 - 2030 |
 Historical
Years:
|
2017 - 2021 |
 Revenue
2022: |
USD 6.96 Billion |
 Revenue 2030:
|
USD 22.82 Billion |
 Revenue CAGR
(2023 - 2030): |
16.00% |
Fastest Growing Region (2023 -
2030)
|
Asia Pacific |
Largest Region (2022):
|
North America |
Customization Offered
Cross-segment Market Size and
Analysis
for Mentioned Segments- Additional Company Profiles (Upto 5
With
No Cost)
- Additional Countries (Apart From
Mentioned Countries)
- Country/Region-specific Report
- Go To Market Strategy
- Region Specific Market Dynamics
- Region Level Market Share
- Import Export Analysis
- Production Analysis
- Others Request
Customization Speak To
Analyst
| Sr. No. | Offering | Report Coverage |
| 1. | Market Size | In terms of Revenue (USD Million) |
| 2. | Historic Data | 2017 to 2021 |
| 3. | Forecast Data | 2023 to 2030 |
| 4. | Market Drivers, Restraints, Opportunities, & Regional Market Trends | Yes |
| 5. | Market Attractiveness Analysis | Yes |
| 6. | Segment Analysis | Maximum Segments |
| 7. | Regional Coverage | 5 Regions |
| 8. | Country Coverage | Top 22 Countries |
| 9. | Competitive Landscape and Company Market Share Analysis | Yes. Exhaustive information will be provided in two separate chapters of Competitive Landscape and Company Profiles. |
| 10. | Porter’s Five Forces Analysis | Yes. |
| 11. | Value Chain Analysis | Yes |
| 12. | PEST Analysis | Yes |
| 13. | Regulatory Landscape | Yes |
| 14. | Technology Landscape | Yes |
| 15. | COVID-19 Impact Analysis | Yes. Exhaustive information for Key Strategies Undertaken by Companies, Impact Assessment of the COVID-19 Pandemic by Region, along with Short-term and Long-term dynamics. |
| 16. | Top startups to watch out for | Yes |
| 17. | Top 3 Trends to Watch | Yes |
| 18. | Top 3 Strategies Followed by Major Players | Yes |
| 19. | Top 3 Predictions by Vantage Market Research | Yes |
| 20. | Discussion Guide | Yes |
| 21. | Key Primary Respondents - VERBATIM | Yes |
| 22. | Transcripts from the Primary Respondents | Additional Cost USD 1,000 |
| 23. | Others/Miscellaneous | |
Vantage Market
Research | 09-Feb-2023
FAQ
Frequently Asked Question
What is the global demand for 3D TSV Packages in terms of revenue?
-
The global 3D TSV Packages valued at USD 6.96 Billion in 2022 and is expected to reach USD 22.82 Billion in 2030 growing at a CAGR of 16.00%.
Which are the prominent players in the market?
-
The prominent players in the market are Amkor Technology Inc. (US), Jiangsu Changjiang Electronics Technology Co. (China), Toshiba Electronics Co. Ltd. (Japan), Samsung Electronics Co. Ltd. (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), United Microelectronics Corporation (Taiwan), Xilinx Inc. (US), Teledyne DALSA Inc. (Canada), Tezzaron Semiconductor Corporation (US), Sony Corporation (Japan), Intel Corporation (US), SK Hynix Inc. (South Korea), Invensas Corporation (US), Broadcom Ltd. (US), Pure Storage Inc. (US), ASE Technology Holding Co. Ltd. (Taiwan), STMicroelectronics NV (Switzerland).
At what CAGR is the market projected to grow within the forecast period?
-
The market is project to grow at a CAGR of 16.00% between 2023 and 2030.
What are the driving factors fueling the growth of the market.
-
The driving factors of the 3D TSV Packages include
- Expanding Market for High Performance Computing Application
Which region accounted for the largest share in the market?
-
North America was the leading regional segment of the 3D TSV Packages in 2022.
